Model 2227 Q-Module
Inertial Navigation Accelerometer
The Model 2227 "Q-Module" is a low-mass, low-power MEMS inertial accelerometer, designed for inertial navigation and tilt applications requiring zero-to-medium frequency response. It features an industry-standard form factor and pin configuration that is directly compatible with traditional quartz inertial accelerometers. Model 2227 modules are assembled with a high-temperature, open printed circuit board (PCB), with a circuit that converts accelerometer differential output voltage into a level of current directly proportional to the amount of applied acceleration. This design allows the Model 2227 to achieve the necessary low-noise, high-stability, long-term repeatability and low power requirements of today's inertial navigation applications, at a competitive price point.
Design of all Silicon Designs high-performance, low-noise MEMS accelerometers are based upon the same hermetically sealed, nitrogen-damped sensor, which provides both DC (constant) and AC (vibration) response. Our custom Digital and Analog ASICs allow us to produce a variety of MEMS DC accelerometer products with outputs, sensitivities, and form factors to fit nearly any application, whether DC or AC.
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SDI 2227 Analog MEMS Accelerometer Q-Module
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Offered in Three Unique Ranges: ±10 g, ±25 g and ±50 g
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Excellent Long-Term, In-Run Bias Stability
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Small Bias and SF Temperature Coefficients
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±9 to ±16 Volt DC, 16 mA Peak
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-55°C to +125°C Operation
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Calibrated Internal Temperature Sensor
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±4.0 mA Full Scale Current Output
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Two Built-In Self Tests
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Low Mass, 5.6 grams
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Form Factor and Pin Compatibility with Industry-Standard Quartz Accelerometers
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Built-in Adjustable Scaling Factor, Allowing End-user to Achieve >25% Higher Accelerometer Voltage Output Flexibility at any Specified g-Range.
Overall design of the Silicon Designs rugged Model 2227 Q-Module MEMS inertial navigation accelerometer combines two patented capacitive silicon sense elements (U.S. Patent Number 4,736,629) with a precision, custom CMOS integrated circuit. The elements and circuit are housed together within a compact, low mass, hermetically sealed LCC package. The differential output voltage of the MEMS inertial accelerometer is converted on the PCB into a current proportional to the applied acceleration. Final testing is conducted on a temperature-tumble-system, ensuring thermal calibration parameters that simplify accelerometer use with the customer’s own real-time temperature compensation and modeling software.
Accelerometer sensitivity is a function of both g-level and full-scale differential output (4000 mV). Silicon Designs' custom MEMS sensing elements for each sensor specify the frequency response by g-range, resulting in a lower noise accelerometer.
The Silicon Designs MEMS accelerometer used in the Model 2227 Q-Module generates a differential output voltage, which is then converted on the PCB into a current proportional to the applied acceleration, as shown in the adjacent figure.
The Model 2227 input axis is perpendicular to the PCB and the MEMS accelerometer. The seismic center is located at the geometric center of the PCB, inside of the LCC accelerometer.
